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For your manufacturing challenges, the answer is extreme fine pitch flex circuits. Other manufacturers offer 4 mil pitch as fine line, but Eastprint, in addition to conventional flex circuits, delivers true 1 mil pitch fine line Micro-Flex circuits to fit the smallest and most complex product designs.
Suitable for wet processes, cryogenic and high-temperature environments, our rugged and reliable micro-connection circuits can withstand harsh environmental conditions.
We provide total concept and design support for your requirements in a wide variety of OEM applications ranging from industrial, automotive, aerospace, communications and computers to medical, FPD/LCD, data storage and hand-held/portable electronics.
Contact us today for further information on our new Micro-Flex products.
Precision Custom Flex Interconnect Solutions
Using the widest range of metal alloy foils available, Eastprint manufactures precision standard and high-density flex circuitry for multi-environment applications. Lightweight, bendable and more compact than traditional rigid board technology, quality flex interconnection circuits can be custom designed to conform to any product size and space constraint.
With full-service manufacturing, from conceptual design through back-end production
consulting, Eastprint provides customers with the right flex solutions.
Competitively priced
Custom design prototyping
3-layer dynamic HDI flex
Termination of flex circuit designs
Single-sided, double-sided and multi-layered flex circuits
HDI flex connection assembly, SMD and Dip-type designs
Specialty flex designs for cryogenic and high-temp applications
Widest range of metals and foil thickness as fine as .0001 inches
Harsh environment and chemical resistant coverlayers available
Laser engraving and photo-imageable coverlayer material options
Engineering R & D and technical support services
Prototype and high-volume manufacturing
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